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HFLoRa Long-Range Communication PCB Module

HFLoRa Long-Range Communication PCB Module

This module is built on the new-generation SX1262 LoRa chip, offering a compact size, extended communication range, and enhanced interference resistance.

Designed for Sub-GHz frequency bands, it can be integrated with LoRa gateways and connected to platforms such as TTN (The Things Network) to build LoRa-based wireless networks.

This product is an industrial-grade LoRa wireless communication module based on the Semtech SX1262 chipset. It operates in the 850–930 MHz frequency band and supports dual modulation modes: LoRa and (G)FSK.

It features long-range transmission, ultra-low power consumption, and strong anti-interference capability, making it ideal for IoT, industrial data acquisition, smart sensing, and other long-distance low-power wireless applications.

This is an industrial-grade, low-power, long-range Sub-GHz LoRa communication module, optimized for:

  • Long-distance transmission
  • Low power consumption
  • Strong anti-interference performance

It is widely used in:

  • Internet of Things (IoT)
  • Industrial data acquisition
  • Wireless sensing
  • Remote control systems

Key Advantages:

  • Compared to legacy SX127x series, the SX1262 offers:
    • Lower power consumption
    • Higher receiver sensitivity
    • Longer communication range (up to 5–10 km in line-of-sight conditions)
  • Supports LoRa spread spectrum + (G)FSK dual modulation, enabling:
    • Long-range, low-speed communication (LoRa)
    • Short-range, high-speed communication (FSK)
ParameterSpecification
RF ChipSemtech SX1262
Frequency Band850–930 MHz (supports 868 / 915 MHz for EU / US / Oceania)
ModulationLoRa / (G)FSK
Transmit PowerUp to 22 dBm @ 3.3V (107 mA @ 22 dBm; 45 mA @ 14 dBm)
Receiver SensitivityLoRa: -148 dBm (SF12, 125 kHz); FSK: -126 dBm
Data RateLoRa: 0.018–62.5 kbps; (G)FSK: 0.6–300 kbps
Spreading FactorSF5–SF12
Operating Voltage3.3V (compatible with 1.8–3.7V)
Power ConsumptionRX: 5.3 mA; Sleep: <1 μA; TX: 107 mA @ 22 dBm
InterfaceSPI (up to 18 MHz), with BUSY, RESET, DIO1/DIO2 pins
Package / SizeStamp-hole + pad, 2.54 mm pitch; 19.0 × 22.0 mm
Operating Temperature-40°C to +85°C (industrial grade)
HFLoRa Long-Range Communication PCB Module-lst-iot

The module uses a standard SPI interface. Key pins include:

SPI Interface:

  • CS – Chip Select
  • CLK – Clock
  • MOSI – Master Output, Slave Input
  • MISO – Master Input, Slave Output

Control Pins:

  • RESET – Reset (active low)
  • BUSY – Busy status (high = busy)
  • DIO1 / DIO2 – Interrupt / status output

RF & Power:

  • ANT – Antenna interface (requires external SMA or IPEX antenna)
  • VCC – Power supply (3.3V)
  • GND – Ground

Core Functions

  • LoRa Spread Spectrum Communication
    Strong anti-interference and diffraction capability, ideal for complex industrial and outdoor environments
  • Ultra-Low Power Operation
    Deep sleep mode (<1 μA), suitable for battery-powered devices such as sensor nodes
  • Dual Modulation Switching
    Flexible switching between LoRa (long-range) and FSK (high-speed short-range)
  • Enhanced Reliability Features
    Supports:
    • Listen Before Talk (LBT)
    • RSSI signal detection
    • CRC error checking
    • Data encryption
  • Industrial IoT
    Remote instruments, sensors, PLC wireless communication
  • Smart Agriculture & Environmental Monitoring
    Soil, weather, and water quality data collection
  • Smart Metering & Security Systems
    Meter reading, alarm systems, wireless control
  • Outdoor Equipment Monitoring
  • LoRaWAN Nodes
    Connect to networks via LoRa gateways (e.g., TTN)

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